Reflow oven zone temperature set up and thermal profile.Save optimized parameters as per the target board’s reflow specification.Adjust the parameter setup and test several times to find the upper limit and bottom line of the real-time reflow profile.Compare real-time thermal data with the virtual profile.Burn-in a test board with thermal shock and mechanical shock to check the board’s reliability.Check the solder joint quality, PCB and component status.Reflow the board and measure the real time thermal profile simultaneously.So, you must analyze your target board first before creating a unique reflow profile.Ī virtual reflow profile is based upon soldering theory, the recommended solder profile from the solder paste manufacturer, size, thickness, cooper weight, layers of the board and size, and the density of the components.
Big components may need more time to heat up than small ones.
It is also quite different when the components absorb the heat to warm up. The PCB thermal capacity is different according to the material type, thickness, copper weight and even the shape of the board. Does it mean that every spot in this GREEN area should fit your board reflow application? The answer is absolutely NO! The GREEN area is the acceptable range for the whole reflow process.
According to the recommendation by the IPC association, the generic Pb-free solder reflow profile is shown below.
